Tài liệu IEEE - 2nd (đọc kỹ bài đầu tiên trước khi gửi yêu cầu)

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Switching-level simulation model for SSSC with EMTP
Han, B.M. Park, J.K. Moon, S.I. Karady, G.G.
Myongji Univ., Seoul, South Korea
This paper appears in: Power Engineering Society 1999 Winter Meeting, IEEE
Publication Date: 31 Jan-4 Feb 1999
Volume: 2
On page(s): 1259 - 1263 vol.2
Number of Pages: 2 vol. xxiii+1340
ISBN: 0-7803-4893-1
INSPEC Accession Number:6215176
Digital Object Identifier: 10.1109/PESW.1999.747394
Date Published in Issue: 2003-09-23 16:52:11.0
Link: http://ieeexplore.ieee.org/search/srchabstract.jsp?arnumber=747394&isnumber=16130&punumber=6033&k2dockey=747394@ieeecnfs&querysssc)%3Cin%3Emetadata)&pos=14&access=no

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1.Design of partial discharge analyser for true compatibility and resolution extension
Senthil Kumar, S.;
Science, Measurement and Technology, IEE Proceedings -
Volume 151, Issue 4, 2 July 2004 Page(s):285 - 290
Digital Object Identifier 10.1049/ip-smt:20040569

Abstract | Full Text: PDF(536 KB) IET JNL rfdr

2.Partial Discharge Measurement on Three phase Construction
Khayam, U.; Ohtsuka, S.; Matsumoto, S.; Hikita, M.;
Properties and applications of Dielectric Materials, 2006. 8th International Conference on
June 2006 Page(s):301 - 304
Digital Object Identifier 10.1109/ICPADM.2006.284176

Abstract | Full Text: PDF(4900 KB) IEEE CNF

3.Partial Discharge Potential Free Test Methods
Mentlik, V.; Pihera, J.; Trnka, P.; Martinek, P.;
Electrical Insulation and Dielectric Phenomena, 2006 IEEE Conference on
15-18 Oct. 2006 Page(s):586 - 589
Digital Object Identifier 10.1109/CEIDP.2006.312000


Abstract | Full Text: PDF(108 KB) IEEE CNF

Abstract | Full Text: PDF(404 KB) IEEE CNF

4.Partial discharge measurement as a Diagnostic Tool for HV-Equipments
Muhr, M.; Schwarz, R.;
Properties and applications of Dielectric Materials, 2006. 8th International Conference on
June 2006 Page(s):195 - 198
Digital Object Identifier 10.1109/ICPADM.2006.284151

Abstract | Full Text: PDF(4541 KB) IEEE CNF

5.A partial discharge data acquisition system based on programmable digital oscilloscopes
Mota, H.O.; Vasconcelos, F.H.;
Instrumentation and Measurement Technology Conference, 2001. IMTC 2001. Proceedings of the 18th IEEE
Volume 2, 21-23 May 2001 Page(s):994 - 999 vol.2
Digital Object Identifier 10.1109/IMTC.2001.928229

Abstract | Full Text: PDF(644 KB) IEEE CNF

6. Pulse sequence studies on PD data
Senthil Kumar, S.; Narayanachar, M.N.; Nema, R.S.;
Electrical Insulation and Dielectric Phenomena, 2002 Annual Report Conference on
20-24 Oct. 2002 Page(s):724 - 727
Digital Object Identifier 10.1109/CEIDP.2002.1048898
Abstract | Full Text: PDF(325 KB) IEEE CNF

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1. SMT process recommendations. Defect minimization methods for a no-clean SMT process
Rajewski, K.
Market Technol., Kester Solder Co., Des Plaines, IL, USA;
This paper appears in: Northcon 95. I EEE Technical Applications Conference and Workshops Northcon95
Publication Date: 10-12 Oct. 1995
On page(s): 354 - 362
Meeting Date: 10/10/1995 - 10/12/1995
Location: Portland, OR
ISBN: 0-7803-2639-3
Digital Object Identifier: 10.1109/NORTHC.1995.485096
Date Published in Issue: 2002-08-06 19:52:44.0
Abstract
Key competitive advantages can be obtained through the minimization of process defects and disruptions. In today''s electronic manufacturing processes there are many variables to optimize. By gaining an understanding of what the defects are, and where they come from, is a key step in the process towards defect free/six sigma manufacturing. In the last decade, surface mount technology processes have been slowly converting towards the no-clean philosophy. This new trend has spawned new processing issues which need to be addressed. This paper investigates solutions to current problems in the processing of no-clean SMT processes. These solutions will be critical in the development of successful processes in the electronics industry in the years ahead
2. An AOI algorithm for PCB based on feature extraction
Fupei Wu, Xianmin Zhang, Yongcong Kuan, Zhenzhen He,
College of Mechanical Engineering, South China University of Technology, Guangzhou, 510640, Guangdong, China
This paper appears in: Intelligent Control and Automation, 2008. WCICA 2008. 7th World Congress on
Publication Date: 25-27 June 2008
On page(s): 240 - 247
Number of Pages: 240 - 247
Location: Chongqing, China
ISBN: 978-1-4244-2113-8
Digital Object Identifier: 10.1109/WCICA.2008.4592931
Date Published in Issue: 2008-08-08 15:07:55.0
Abstract
With the development of the micro-electronic industry, electronical components assembled on the printed circuit board (PCB) become more and more microsize and its mounted density is increasing. It is out of date to depend on manual inspection to assure the joints quality. Instead, automated optical inspection (AOI) for solder joints based on the machine vision has become more and more important. In this paper, based on the image acquired from a 3-CCD color camera and a 3-color hemispherical LED arrays light resource (red, green, and blue), the place, shape, and logical features of solder joints of chip components are extracted. The place features are related to solder joint place. As for shape features, we divide solder joint into several regions and extract its shape features by its color, occupancy ratio of area, center of gravity and continuous pixels. The logical features come from their close relationships of different regions of shape features, color distributing and place features. On the basis of the features, an AOI algorithm is developed. The defects of lacking solder, surplus solder, no solder, pseudo joints, wrong component, damaged component, component absent, shift, tomb stone, wrong polarity, etc. can be identified properly by using the proposed algorithm. Finally, some experiment results are presented to show the vali***y of the algorithm.
3. Optimized design of an AOI illuminator
Sheng-Lin Lu Xian-Min Zhang Yong-Cong Kuang
South China Univ. of Technol., Guangzhou
This paper appears in: Wavelet Analysis and Pattern Recognition, 2007. ICWAPR ''07. International Conference on
Publication Date: 2-4 Nov. 2007
Volume: 2
On page(s): 924 - 928
Number of Pages: 924 - 928
Location: Beijing
ISBN: 978-1-4244-1065-1
Digital Object Identifier: 10.1109/ICWAPR.2007.4420801
Date Published in Issue: 2008-01-07 11:59:16.0
Abstract
This paper investigates an illuminator for automatic optical inspection (AOI) machine. The structure of the illuminator was determined first, the illuminator composed three light emitting diode (LED) array sources; the color and the radiation angle of each LED array source are different. Then, the irradiation model of the illuminator was established according to the structure. Finally, the dimensions of the illuminator were optimized based on the irradiation model. Several experimental results show that the illuminator can improve the stability of the AOI.
4. Cost Effective Component Placement Quality Measure through Pre-reflow AOI and SPC Tools - one step to the DPC
Janoczki, M. Szabo, A.
Budapest Univ. of Technol. & Econ., Budapest
This paper appears in: Electronics Technology, 30th International Spring Seminar on
Publication Date: 9-13 May 2007
On page(s): 434 - 438
Number of Pages: 434 - 438
Location: Cluj-Napoca
ISBN: 987-1-4244-1218-1
Digital Object Identifier: 10.1109/ISSE.2007.4432895
Date Published in Issue: 2008-01-21 10:00:58.0
Abstract
Automated Optical Inspection (AOI) is a useful tool for assessing workmanship compliance in production PCB assembly environments. With advanced lighting, optics, and image processing capabilities, the machines greatly enhance inspection repeatability, accuracy and throughput. The in-line automatic optical inspection machines usually are not accurate enough to measure the Cmk of the component placement machines, but the x,y shift and the rotation of the components could be measured with circa 25 mum precision.
5.

Characteristics of Lead-Free Solders During Flow Soldering (Selective and Wave Soldering)
Pape, U. Schulz, J.-U.
Fraunhofer Inst. for Reliability & Microintegration, Berlin
This paper appears in: Electronics Systemintegration Technology Conference, 2006. 1st
Publication Date: Sept. 2006
Volume: 1
On page(s): 139 - 144
Number of Pages: 139 - 144
Location: Dresden
ISBN: 1-4244-0553-x
Digital Object Identifier: 10.1109/ESTC.2006.279991
Date Published in Issue: 2007-01-15 13:05:39.0
Abstract
The use of lead-free solders requires new fundamental information for flow soldering. Parameters, approved for many years with the solder SnPb, for wave height, flow speed and also the tear-off angle must be defined again for lead-free solders. In ad***ion, the corrosion of substrate metallization and especially of machines (crucible and other parts in liquid solder) is under discussion for lead-free soldering today. A new combined measurement method for analyzing the characteristics of new solder in a relatively short time was developed at IZM. Therefore, the surface energy as a value for tear-off behavior, the viscosity as a value for the flow behavior and also the corrosion rate were measured. A comparison between different solders or solder alloys provides the solder manufacturers as well as the solder machine manufacturer with important data for the application and further development of new technologies
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